Surface Mount Technology (SMT) is a technology of soldering electrical components onto the pre-printed circuit boards. In order to make the whole process possible, SMT reflow soldering oven is usually used. This is a machine that employs high level of technology and bonding principles in its functionality. It is very complex but offers reliability and better alternative in the field of electrical assembly. This comes with advantages such as reduced board cost, controlled manufacturing and assembling process and reduced material handling.
This is one of the machines that get used more often than any other machines in the electrical line of assembly. Before passing over to the oven, the solder paste made of flux, small solder particles and chemical cleaning agents is used to loosely attach the electrical components on to the printed circuit board (PCB) and then sent to the next step.
The beginning point is making of the soldering paste. This is a mixture of flux, some chemical used as cleaning agent and small solder particles. This makes a sticky paste that is used to loosely hold the electronics on to their predetermined positions on the PCB.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
This is followed by thermal soak zone where the PCB and its components are exposed to heating at specific temperature for between 60 to 120 seconds to remove paste volatiles. The third stage is reflow zone. At this stage, PCB gets exposed to the maximum possible temperature that is tolerable by all the electronics on it. This is usually set below the liquidus temperature-the temperature above which the electronics get destroyed. At this point, the surface tension at the joints and the joints is reduced, melting the solder and as such bonding the pads and electronics.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
SMT reflow soldering oven comes with a number of advantages such as simpler and much faster automated assemblies, very small levels of errors in component mounting, high level of production rate (some capable of placing up to 136,000 components per hour), possible to mount components on both side of the PCB, and electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
This is one of the machines that get used more often than any other machines in the electrical line of assembly. Before passing over to the oven, the solder paste made of flux, small solder particles and chemical cleaning agents is used to loosely attach the electrical components on to the printed circuit board (PCB) and then sent to the next step.
The beginning point is making of the soldering paste. This is a mixture of flux, some chemical used as cleaning agent and small solder particles. This makes a sticky paste that is used to loosely hold the electronics on to their predetermined positions on the PCB.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
This is followed by thermal soak zone where the PCB and its components are exposed to heating at specific temperature for between 60 to 120 seconds to remove paste volatiles. The third stage is reflow zone. At this stage, PCB gets exposed to the maximum possible temperature that is tolerable by all the electronics on it. This is usually set below the liquidus temperature-the temperature above which the electronics get destroyed. At this point, the surface tension at the joints and the joints is reduced, melting the solder and as such bonding the pads and electronics.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
SMT reflow soldering oven comes with a number of advantages such as simpler and much faster automated assemblies, very small levels of errors in component mounting, high level of production rate (some capable of placing up to 136,000 components per hour), possible to mount components on both side of the PCB, and electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
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